High heat-resistant removable film
ET
ET type is high heat-resistant removable adhesive film. It is high heat-resistant removable film which can be used consistently in FPC and COF processing from the photo resist process to the solder resist drying and plating processes and can be removed without leaving behind any adhesive even after the heat treatment process.
Features
- High heat-resistant removable adhesive film which can be used consistently in the FPC and COF roll and sheet products manufacturing process from photo resist to coverlay pressing and plating.
- Film that can be used as support for ultra-thin coverlay and as press process reinforcement.
- Can be used as processing support for extremely thin copper film.
- Low shrinkage type with little dimensional change after heating.
- A type which uses a non-silicone separator is also available.
Main applications
- Reinforcing of ultra-thin CCL from photo resist to plating during FPC manufacture
- Support for ultra-thin coverlay pressing
- Support for various ultra-thin film processing
Composition
Standard specifications
Adhesive strength
| Product name | Adhesive strength*1 Adherend : Polyamide | ||
| Initial | After pressing*2 | After heating*3 | |
| ET-50B | 0.03（7.7） | 0.05（12.8） | 0.08（20.5） |
| ET-K50B | 0.04（10.3） | 0.06（15.4） | 0.07（17.9） |
*1Peeling angle: 180o, peeling speed: 300mm/min. Folded adhesive tape base material
*2Press conditions : 180°C×10MPa×1h
*3Heating conditions : 150°C×2h
※The above are measurement values and are not guaranteed.
Heat shrinkage
| Product name | Heat shrinkage(150°C×30min) | |
| MD | TD | |
| ET-50B | 0.67% | 0.04% |
| ET-K50B | 0.11% | 0.02% |
※The above are measurement values and are not guaranteed.
Example of use
①Carrier film laminating |
 |
④Resist removal process |
②Photo resist process |
⑤Coverlay laminating process |
|
③Etching process |
⑥Carrier film removal |
